正在顯示 1 至 4 筆資料（共 4 筆資料）
電子工程學系博士研究生Ahmed Sharif憑藉有關環保無鉛焊料的研究，於「2004年電子封裝國際會議」中獲頒青年獎，而Ahmed是唯一獲獎的香港學生。
The Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering (EPA Centre) was accredited in December 2003 by the Hong Kong Accreditation Service (HKAS) for its Ionic Analysis of Circuit Board, Ion Chromatography Method.
由城大電腦學部舉辦的「第二屆電腦遊戲應用及開發技術國際會議」已於1月6日及7日舉行。是次會議吸引了過百名學術界及業內人士參加，主講者分析電腦遊戲開發行業在現今資訊時代所面對的技術和應用上挑戰。會上發表學術論文超過45份。
On 21 November, CityU's Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering (the EPA Centre) was accepted by the Hong Kong Accreditation Service (HKAS) as an Accredited Laboratory* under the Hong Kong Laboratory Accreditation Scheme (HOKLAS). This is a CityU first.