Semiconductors are everywhere – from the processor and AI chips in our smartphones to electronic devices for electric and autonomous vehicles, to new sensors for healthcare. Training required for manufacturing and semiconductor technology is developing rapidly in a wide range of fields. Besides the semiconductor manufacturing process, the semiconductor industry is capital-intensive and must focus on realistic needs for manufacturing intelligence, including new fab construction, technology migration, capacity transformation and expansion, tool procurement, and outsourcing. Recently, semiconductor manufacturing has also become a global geopolitical battleground. Thus, there is a need for professional education to train engineers in Hong Kong and mainland China to acquire the capabilities of intelligent and semiconductor manufacturing.

The programme is designed to provide students with knowledge/skills in process control/operations, electronic and advanced packaging technologies, and materials in intelligent and semiconductor manufacturing and its related reliability science and quality engineering. Ability to solve problems and develop new processes or equipment. Students are encouraged to participate in the projects with the companies. The objective of this programme is to prepare students who wish to pursue graduate degrees or enter the workforce in the field of the semiconductor and electronics industry.

Applicants should satisfy the General Entrance Requirements and the following programme specific entrance requirements:

• hold a degree in engineering, science or equivalent; or
• be a graduate member or a non-member qualified for graduate membership of professional institutions, for example, the Hong Kong Institution of Engineers (HKIE), member institutions of the Engineering Council (UK) and other recognized professional institutions; or
• qualifications with evidence of academic and professional attainment acceptable to the University

English Proficiency Requirements

Applicants whose entrance qualification is obtained from an institution where the medium of instruction is NOT English should also fulfill the following minimum English proficiency requirement:

• a score of 79 (Internet-based test) in the Test of English as a Foreign Language (TOEFL)^@#; or
• an overall band score of 6.5 in International English Language Testing System (IELTS)^@; or
• a score of 450 in the Chinese mainland’s College English Test Band 6 (CET-6); or
• other equivalent qualifications.

^@ TOEFL and IELTS scores are considered valid for two years. Applicants are required to provide their English test results obtained within the two years preceding the start of the University's application period.

^# Applicants are required to arrange with the Educational Testing Service (ETS) to send their TOEFL results directly to the University. The TOEFL institution code for CityU is 3401.

You may obtain the MSc degree by either

1. completing taught courses only, or
2. taught courses plus the dissertation project.

Required Core Courses (12 credit units)

• Quality and Reliability Engineering
• Semiconductor Manufacturing and Management
• 3D IC Stacking and Advanced Packaging
• Semiconductor Process Equipment and Material

Programme Electives (18 credit units)

Electives (Select any six 3-CU courses OR three 3-CU courses and a 9-CU dissertation)

• Project Management
• Technological Innovation and Entrepreneurship
• Dissertation
• Quality Improvement: Systems and Methodologies
• Intelligent Manufacturing for Engineering Managers
• VLSI/ULSI Process Integration
• Process Modelling and Control

For a full list of elective courses, please visit https://www.cityu.edu.hk/sye/mssm.htm

Remark: These elective courses will be offered subject to the availability of resources.

• MSc Degree in Intelligent Semiconductor Manufacturing (30 credit units)

The full MSc degree award requires 30 credit units, with the completion of taught courses only, or taught courses plus the dissertation project.

Course Descriptions
Department of Systems Engineering
College of Engineering