Master of Science in Intelligent Semiconductor Manufacturing
理學碩士(智能半導體製造)
Programme code: P86
Embark on a transformative journey with our Internship Programme, designed specifically for postgraduate students aiming to bridge the gap between theoretical knowledge and practical work experience. This programme offers numerous internship positions in renowned industries for students during the summer term. This unique opportunity allows you to apply what you've learned in the classroom to real-world settings for 6 to 12 weeks. Students who demonstrate excellent performance during the internship will have the opportunity to secure a position within the company upon completion. Don't miss this chance to enhance your skills, boost your career prospects, and work alongside industry experts.
Programme Aims
The programme is designed to provide students with knowledge/skills in process control/operations, electronic and advanced packaging technologies, and materials in intelligent and semiconductor manufacturing and its related reliability science and quality engineering. Ability to solve problems and develop new processes or equipment. Students are encouraged to participate the projects with the companies. The objective of this programme is to prepare students who wish to pursue graduate degrees or enter the workforce in the field of semiconductor and electronics industry.
Programme Intended Learning Outcomes (PILOs):
Upon successful completion of this Programme, students are expected to:
- reflect on extensive knowledge in intelligent and semiconductor manufacturing in supporting problem solving, decision making and undertaking projects of discovery and innovation;
- apply knowledge/skills in semiconductor process control/operations, electronic and advanced packaging technologies, and materials; integrate and apply engineering and knowledge in intelligent and semiconductor manufacturing and its related reliability science and quality engineering;
- be able to generate innovative ideas, to undertake projects/research and turn the discovery & innovative ideas into practical implementation;
- reflect on responsibility and sensitivity for environmental and societal concerns, inter-cultural issues and global development.
Programme Structure and Contents
Path of study: You may obtain the MSc degree by either
- completing taught courses only, or
- taught courses plus the dissertation project.
Required Core Courses (12 credit units)
| Course Code | Course Title | Credit Units |
|---|---|---|
| SYE6043 | Quality and Reliability Engineering | 3 |
| SYE6109 | Semiconductor Manufacturing and Management | 3 |
| SYE6201 | 3D IC Stacking and Advanced Packaging Technology | 3 |
| SYE6202 | Semiconductor Process Equipment and Materials | 3 |
Programme Electives (18 credit units)
Electives (Select any six 3-CU courses OR three 3-CU courses and a 9-CU dissertation)
| Course Code | Course Title | Credit Units |
|---|---|---|
| EE6615 | Nanotechnology for Devices and Microsystems | 3 |
| MNE6005 | Micro Systems Technology | 3 |
| MNE6046 | Nano-manufacturing | 3 |
| MNE6051 | Sustainable Green Manufacturing | 3 |
| MSE6121 | Thin Film Technology and Nanocrystalline Coatings | 3 |
| MSE6171 | Electronic Packaging and Materials | 3 |
| SYE6009 | Project Management | 3 |
| SYE6012 | Technological Innovation and Entrepreneurship | 3 |
| SYE6018 | Dissertation | 9 |
| SYE6045 | Industrial Case Study | 3 |
| SYE6047 | Quality Improvement: Systems and Methodologies | 3 |
| SYE6106 | Intelligent Manufacturing for Engineering Managers | 3 |
| SYE6110 | Data Analysis and Artificial Intelligence for Systems Engineering | 3 |
| SYE6203 | Internship Scheme in Semiconductor Industry | 3 |
| SYE6204 | VLSI/ULSI Process Integration | 3 |
| SYE6205 | Semiconductor Thin Film Engineering | 3 |
| SYE6206 | Packaging for Nanoelectronics | 3 |
| SYE6207 | Characterization Techniques for Semiconductor Manufacturing | 3 |
| SYE8204 | Process Modelling and Control | 3 |
Remark: These elective courses will be offered subject to the availability of resources.
Internship
Embark on a transformative journey with our Internship Program, designed specifically for postgraduate students aiming to bridge the gap between theoretical knowledge and practical work experience. This unique opportunity allows you to apply what you've learned in the classroom to real-world settings, both locally and internationally, for 6 to 12 weeks. In collaboration with leading companies in the semiconductor industry, such as SwaySure, HiSilicon, etc., we offer hands-on experience in the technology and innovation sector. Don't miss this chance to enhance your skills, boost your career prospects, and work alongside industry experts.
Student Handbook (PDF)
Admission Requirements
Applicants must satisfy the University's General Entrance Requirements and the following programme entrance requirements:
- a bachelor’s degree holder in engineering, science or other relevant disciplines, or its equivalent.
Non-local candidates from an institution where the medium of instruction is not English should fulfil one of the following English proficiency requirements:
- a score of 79 (Internet-based test) in the Test of English as a Foreign Language (TOEFL); or
- an overall band score of 6.5 in International English Language Testing System (IELTS); or
- a score of 450 in the new College English Test (CET6) of China mainland or a pass in the old CET6 test; or
- other equivalent qualifications.
TOEFL and IELTS scores are considered valid for two years. Applicants are required to provide their English test results obtained within the two years preceding the start of the University's application period. 'TOEFL iBT Home Edition', ‘TOEFL MyBest Score’, ‘IELTS Indicator’, ‘IELTS One Skill Retake’ and ‘IELTS Online’ are not acceptable.
Applicants are required to arrange with the Educational Testing Service (ETS) to send their TOEFL results directly to the University. The TOEFL institution code for CityU is 3401.
Financial Aids & Scholarship
The Department of Systems Engineering Entrance Scholarships for Master's Programmes:
The value of each award shall not exceed HK$25,000.
The Department of Systems Engineering Entrance Scholarships for International Postgraduate students: The value of each award is HKD $5,000.00 to $10,000.00.
(subject to availability of resources)
Tuition Fees
HK$6,700 per credit (for local and non-local students admitted in 2025/26)
Total credit units required: 30
Duration of study
| Normal Period | Maximum Period |
| Full-time (1 year) | FT (2.5 years) |
| Part-time (2 years) | PT/combined mode (5 years) |
Contact Us
Programme Leader General EnquiriesEmail: sye.office@cityu.edu.hk
For application enquiries, please contact School of Graduate Studies (SGS) at tpadmit@cityu.edu.hk
For visa matters, please contact Global Engagement Office (GEO) at geoins@cityu.edu.hk
Last modified on 14 October, 2024