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Mr Ahmed Sharif, a PhD student of the Department of Electronic Engineering, won the IEEE CPMT Young Award for his research paper on lead-free solder.
The Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering (EPA Centre) was accredited in December 2003 by the Hong Kong Accreditation Service (HKAS) for its Ionic Analysis of Circuit Board, Ion Chromatography Method.
More than 100 academics and professionals from 14 countries and regions around the world participated in the 2nd International Conference on Application and Development of Computer Games held at City University from 6 to 7 January, which presented a broad perspective of technical and application challenges to the computer game industry in the information age. More than 45 papers were presented at the conference, which was organized by CityU's Division of Computer Studies.
On 21 November, CityU's Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering (the EPA Centre) was accepted by the Hong Kong Accreditation Service (HKAS) as an Accredited Laboratory* under the Hong Kong Laboratory Accreditation Scheme (HOKLAS). This is a CityU first.