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CityU's Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering (EPA) was accredited for the third time by the Hong Kong Accreditation Service, in June 2004.
CityU scores first place in the number and level of grant awards in the “Electrical and Electronic Engineering”and “Mathematics”disciplines in the 2004-05 Competitive Earmarked Research Grants exercise.
With plenty of buzz over Bluetooth wireless technology and mobile systems in our technology-driven lives, CityU's Department of Electronic Engineering seized the opportunity last week to promote its own power electronics and wireless communications developments at the Hong Kong Information Infrastructure Expo.