Publications in 1998

Click paper title to view the full paper using Acrobat Reader

(A) Journal Papers (* Invited) and Book Chapters (**)

  1. P. K. Chu, V. K. F. Chia, S. P. Smith, and C. W. Magee, “Routine Depth Profiling of Shallow Junctions by Secondary Ion Mass Spectrometry”, Materials Chemistry & Physics, vol. 52, no. 1, pp. 60 - 65 (1998).

  2. X. C. Zeng, T. K. Kwok, A. G. Liu, P. K. Chu, and B. Y. Tang, “Plasma Immersion Ion Implantation of the Interior Surface of a Large Cylindrical Bore using an Auxiliary Electrode”, Journal of Applied Physics, vol. 83, no. 1, pp. 44 - 49 (1998).

  3. P. K. Chu, Y. Gao, and J. W. Erickson, “Characterization of III-Nitride Materials and Devices by Secondary Ion Mass Spectrometry (SIMS)”, Journal of Vacuum Science & Technology B, vol. 16, no. 1, pp. 197 - 203 (1998).

  4. A. G. Liu, X. F. Wang, B. Y. Tang, P. K. Chu, P. K. Ko, and Y. C. Cheng, “A Novel Distributed System for Plasma Immersion Ion Implanter Control and Automation”, Review of Scientific Instruments, vol. 69, no. 3, pp. 1495 - 1498 (1998).

  5. P. K. Chu, S. Qin, C. Chan, N. W. Cheung, and P. K. Ko, “Instrumental and Process Considerations for the Fabrication of Silicon-on-Insulator (SOI) Structures by Plasma Immersion Ion Implantation”, IEEE Transactions on Plasma Science, vol. 26, no. 1, pp. 79 - 84 (1998).

  6. R. D. Chang, P. S. Choi, D. L. Kwong, D. Wristers, and P. K. Chu, “Boron Segregation in As-Implanted Si Caused by Electric Field and Transient Enhanced Diffusion”, Applied Physics Letters, vol. 72, no. 14, pp. 1709 - 1711 (1998).

  7. X. C. Zeng, T. K. Kwok, A. G. Liu, P. K. Chu, B. Y. Tang, and T. E. Sheridan, “Plasma Immersion Ion Implantation of Interior Surfaces of a Small Cylindrical Bore using an Auxiliary Electrode for Finite Rise-Time Voltage Pulses”, IEEE Transactions on Plasma Science, vol. 26, no. 2, pp. 175 - 180 (1998).

  8. S. Y. Wang, P. K. Chu, B. Y. Tang, J. C. Yan, and X. C. Zeng, “Improvement of the Wear and Corrosion Resistance of Piston Column of Oil Pump Using Plasma Immersion Ion Implantation”, Surface and Coatings Technology, vol. 98, pp. 897 - 900 (1998).

  9. T. K. Kwok, K. C. Tam, and P. K. Chu, “Interpretation of In-Plane and Off-Plane Anisotropic Surface / Interface Reflectance and Transmittance Difference Spectroscopy”, Journal of the Optical Society of America B, vol. 15, no. 4, pp. 1198 - 1204 (1998).

  10. T. E. Sheridan, T. K. Kwok, and P. K. Chu, “Kinetic Model for Plasma-Based Ion Implantation of a Short, Cylindrical Tube with Auxiliary Electrode”, Applied Physics Letters, vol. 72, no. 15, pp. 1826 - 1828 (1998).

  11. L. M. Lam, C. W. Kwong, H. P. Ho, E. Y. B. Pun, K. S. Chan, Z. N. Fan, and P. K. Chu, “Plasma Immersion Ar+ Ion Implantation Induced Disorder in Strained InGaAsP Multiple Quantum Wells”, Electronics Letters, vol. 34, no. 8, pp. 817 - 818 (1998).

  12. B. Y. Tang, P. K. Chu, S. Y. Wang, K. W. Chow, and X. F. Wang, “Methane and Nitrogen Plasma Immersion Ion Implantation of Titanium”, Surface & Coatings Technology, vol. 103 - 104, no. 1 - 3, pp. 248 - 251 (1998).

  13. Z. Fan, P. K. Chu, C. Chan, and N. Cheung, “Sample Stage Induced Dose and Energy Non-Uniformity in Plasma Immersion Ion Implantation”, Applied Physics Letters, vol. 73, no. 2, pp. 202 - 204 (1998).

  14. R. Morton, S. S. Lau, D. B. Poker, P. K. Chu, N. Wang, and K. K. Fung, “Carbon and Group II Acceptor Coimplantation in GaAs”, Journal of Applied Physics, vol. 84, no. 9, pp. 4929 - 4936 (1998).

  15. Z. Fan, G. Zhao, P. K. Chu, Z. Jin, H. S. Kwok, and M. Wong, “Floating Low-Temperature Radio-Frequency Plasma Oxidation of Polycrystalline Silicon-Germanium”, Applied Physics Letters, vol. 73, no. 3, pp. 360 - 362 (1998).

  16. W. S. Lau, M. T. Chandima Perera, Premla Babu, A. K. Ow, Taejoon Han, N. P. Sandler, C. H. Tung, T. T. Sheng, and P. K. Chu, “The Superiority of N20 Plasma Annealing over O2 Plasma Annealing for Amorphous Tantalum Pentoxide (Ta2O5) Films”, Japanese Journal of Applied Physics Part 2, vol. 37, no. 4B, pp. L435 - L437 (1998) .

  17. J. Liu, G. P. Ru, Z. G. Gu, X. P. Qu, B. Z. Li, and P. Chu, “Thermal Stability Improvement of Ultrathin CoSi2 Film Formed by TiN Capping Layer and Co/Ti/Si Ternary Solid Phase Reaction”, Chinese Journal of Semiconductors, vol. 19, no. 3, pp. 214 - 217 (1998).

  18. A. G. Liu, X. F. Wang, B. Y. Tang, and P. K. Chu, “Dose and Energy Uniformity over Inner Surface in Plasma Immersion Ion Implantation”, Journal of Applied Physics, vol. 84, no. 4, pp. 1859 - 1862 (1998).

  19. G. Q. Li, T. Zhang, T. C. Ma, B. Y. Tang, and P. K. Chu, “Computer Simulation of Multi-Component Ion Beam Enhanced Deposition of (TiMo)N Films”, Surface and Coatings Technology, vol. 110, no. 1 - 2, pp. 1 - 3 (1998).

  20. X. Lu, S. S. K. Iyer, J. Lee, B. Doyle, Z. N. Fan, P. K. Chu, C. M. Hu, and N. W. Cheung, “Plasma Immersion Ion Implantation for SOI Synthesis: SIMOX and Ion-Cut”, Journal of Electronic Materials, vol. 27, no. 9, pp. 1059 - 1066 (1998).

  21. S. Qin, Y. Z. Zhou, C. Chan, and P. K. Chu, “Fabrication of Low Dielectric Constant Materials for ULSI Multilevel Interconnection by Plasma Ion Implantation”, IEEE Electron Device Letters, vol. 19, no. 11, pp. 420 - 422 (1998).

  22. Z. Fan, Q. C. Chen, P. K. Chu, and C. Chan, “Low Pressure Plasma Immersion Ion Implantation of Semiconductors”, IEEE Transactions on Plasma Science, vol. 26, no. 6, pp. 1661 - 1668 (1998).

  23. X. P. Qu, B. Z. Li, G. P. Ru, Z. G. Gu, H. T. Xu, H. X. Mo, J. Liu, and P. Chu, “Heteroepitaxial Growth of CoSi2 on Si(100) Substrate by Co/Si/Ti/Si Multilayer Solid Phase Reaction”, Chinese Journal of Semiconductors, vol. 19, no. 9, pp. 641 - 645 (1998).

  24. T. K. Kwok, P. K. Chu, and C. Chan, “Ion Dose Uniformity for Planar Sample Plasma Immersion Ion Implantation”, IEEE Transactions on Plasma Science, vol. 26, no. 6, pp. 1669 - 1679 (1998).

  25. A. G. Liu, X. F. Wang, Q. C. Chen, B. Y. Tang, and P. K. Chu, “Inner Surface Implantation Using Deflecting Electric Field”, Nuclear Instruments and Methods B: Beam Interactions with Materials and Atoms, vol. 143, no. 3, pp. 306 - 310 (1998).

  26. * P. K. Chu and N. W. Cheung, “Microcavity Engineering by Plasma Immersion Ion Implantation”, Materials Chemistry and Physics, vol. 57, no. 1, pp. 1 - 16 (1998).

  27. S. Ruvimov, Z. Liliental-Weber, J. Washburn, D. Qiao, S. S. Lau, and P. K. Chu, “Microstructure of Ti/Al Ohmic Contacts for n-AlGaN”, Applied Physics Letters, vol. 73, no. 18, pp. 2582 - 2584 (1998).

  28. P. K. Chu, “Analysis of AlxGayInzN Semiconductors”, Chinese Journal of Vacuum Science and Technology, vol. 18, no. 12, pp. 87 - 91 (1998).

(B) Conference Papers (* Invited)

  1. P. K. Chu, “Analysis of Nitride Semiconductors”, Proceedings 2nd International Symposium on Secondary Ion Mass Spectrometry (ISSIMS 98) and 2nd Chinese National Conference on Secondary Ion Mass Spectrometry (SIMS II China), Beijing, China, p. 19, Apr 6 - 10, 1998.

  2. Y. Zhou, S. Qin, C. Chan, and P. K. Chu, “Low-Dielectric Constant SiO2 Films for ULSI Interconnections Prepared by CF4 Plasma Ion Implantation”, in “Low-Dielectric Constant Materials IV”, C. Chiang, P. S. Ho, T.-M. Lu, and J. T. Wetzel (Eds.), Proceedings MRS Spring Conference, San Francisco, California, Paper E1.9, pp. 63 - 68, April 13 – 17, 1998.

  3. Z. Fan, G. Zhao, P. K. Chu, Z. Jin, H. S. Kwok, and M. Wong, “Low Temperature Floating Plasma Oxidation of Poly-Si and Poly-SiGe”, MRS Spring Conference, San Francisco, April 13 – 17, 1998.

  4. T. K. Kwok, X. C. Zeng, and P. K. Chu, “Studies of the Effects of the Bore Length during Plasma Immersion Ion Implantation of a Small Cylindrical Bore with Auxiliary Electrode by Two-Dimensional Fluid Model”, Proceedings IEEE International Conference on Plasma Science (ICOPS ’98), Raleigh, North Carolina, Paper 4P39, p. 217, Jun 1 - 4, 1998.

  5. T. K. Kwok, T. E. Sheridan, X. C. Zeng, and P. K. Chu, “Numerical Simulation of Plasma Immersion Ion Implantation of a Finite-Length Cylindrical Bore with Auxiliary Electrode by Two-Dimensional Fluid Model”, Proceedings IEEE International Conference on Plasma Science (ICOPS ’98), Raleigh, North Carolina, Paper 3A04, p 176, Jun 1 - 4, 1998.

  6. A. G. Liu, X. F. Wang, B. Y. Tang, P. K. Chu, P. K. Ko, and Y. C. Cheng, “A Novel Distributed Control System for Plasma Immersion Ion Implantation Control and Automation”, Proceedings IEEE International Conference on Plasma Science (ICOPS ’98), Raleigh, North Carolina, Paper 4P36, p. 216, Jun 1 - 4, 1998.

  7. Z. M. Zeng, B. Y. Tang, P. K. Chu, X. B. Tian, S. Y. Wang, and X. F. Wang, “Surface Property Enhancement of 9Cr18 Steel Using Plasma Immersion Ion Implantation”, Proceedings Fourth International Workshop on Plasma-Based Ion Implantation, Detroit, Michigan, Paper P-11, Jun 2 - 4, 1998.

  8. A. G. Liu, B. Y. Tang, P. K. Chu, X. F. Wang, S. Y. Wang, Z. M. Zeng, and X. B. Tian, “Simulation of Inner Surface Plasma Immersion Ion Implantation”, Proceedings Fourth International Workshop on Plasma-Based Ion Implantation, Detroit, Michigan, Paper P-8, Jun 2 - 4, 1998.

  9. P. K. Chu, N. W. Cheung, and C. Chan, “Microcavities Formed by Hydrogen or Helium Plasma Immersion Ion Implantation”, XII International Conference on Ion Implantation Technology (IIT/98), Kyoto, Japan, J. Matsuo, G. Takaoka, and I. Yamada (Eds.), pp. 1238 - 1241, Jun 22 - 26, 1998.

  10. R. Günzel, S. Mändl, E. Richter, A. Liu, B. Y. Tang, and P. K. Chu, “Corrosion Protection of Titanium by Deposition of Niobium Thin Films”, Sixth International Conference on Plasma Surface Engineering (PSE), Garmisch-Partenkirchen, Germany, Paper WCP60, September 14 – 18, 1998.

  11. * P. K. Chu, “Microcavity Engineering Using Plasma Immersion Ion Implantation”, Proceedings Fifth International Conference on Solid State and Integrated Circuit Technology (ICSICT'98), Beijing, China, M. Zhang and K. N. Tu (Eds.), pp. 83 - 86, Oct 21 - 23, 1998.

  12. X. P. Qu, G. P. Ru, J. H. Liu, H. X. Mo, J. Liu, B. Z. Li, and P. Chu, “The Effect of Amorphous Si on the Epitaxial Growth of CoSi2 by Co/Si/Ti/Si Solid State Epitaxy”, Proceedings Fifth International Conference on Solid State and Integrated Circuit Technology (ICSICT'98), Beijing, China, M. Zhang and K. N. Tu (Eds.), pp. 264 - 267, Oct 21 - 23, 1998.

  13. X. P. Qu, G. P. Ru, B. Z. Li, J. Qin, Z. M. Jiang, and P. Chu, “Si/CoSi2/Si(100) Heteroepitaxial Growth by Molecular Beam Epitaxy and Novel Solid Phase Epitaxy”, Proceedings Fifth International Conference on Solid State and Integrated Circuit Technology (ICSICT'98), Beijing, China, M. Zhang and K. N. Tu (Eds.), pp. 268 - 270, Oct 21 - 23, 1998.


Publications in 1982-1995, 1996, 1997, 1999, 2000, 2001, 2002, 2003, 2004, 2005, 2006, 2007, 2008, 2009, 2010, 2011, 2012, 2013, 2014, 2015, 2016, 2017, 2018, 2019, 2020, 2021, 2022, 2023, 2024, 2025, 2026, 2027, 2028, 2029, 2030, 2031, 2032, 2033, 2034, 2035