Project: Chemical Additive-Enabled Advancements in Electroplated Copper for Advanced Electronic Packaging and 3DIC Applications

This project focuses on overcoming the complex metallisation challenges in the packaging of three-dimensional integrated circuit (3D IC) semiconductor chips. In 2022, Professor Feng and his team established the company Doctech. Their goal is to develop smaller, more powerful chips with more stable connections. They will develop a series of patented chemical additives for the copper electroplating process, providing customised micro-structured copper for different layers in 3D ICs to ensure reliable performance in high-density, three-dimensional heterogeneous stacked packages. Currently, Doctech has successfully established collaborations with industry-leading companies and plans to build an automated intelligent manufacturing line in 2026. In the future, they will develop other key specialty chemicals for advanced packaging, aiming to become a leading supplier of semiconductor materials in the industry.