Metallic Structure and a Method for Surface Treatment of a Metallic Structure
This patent introduces a novel two-step electrochemical surface treatment method to create metallic structures with precisely controlled nanostructured surfaces. The technology involves first defining an initial surface morphology on a metallic structure, typically by etching away impurities (e.g., copper, aluminum) to create a roughened surface with varied nanostructures.
Prof. LU Jian, Prof. LI Yangyang, Dr. ZHOU Binbin, Dr. SHEN Junda
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Electrochemical Treatment
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Electrodeposition
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Surface Morphology
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Silver Needle
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SERS Substrate
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Nanostructures
