Master of Science in Intelligent Semiconductor Manufacturing
Programme
Master of Science in Intelligent Semiconductor Manufacturing
理學碩士(智能半導體製造)
Award Title
Master of Science in Intelligent Semiconductor Manufacturing
理學碩士(智能半導體製造)
Offering Academic Unit
Department of Systems Engineering
Mode of Study
Combined mode

Normal Period of Study

- 1 year (full-time)
- 2 years (part-time/combined mode)

Maximum Period of Study

- 2.5 years (full-time)
- 5 years (part-time/combined mode)

Credit Units Required for Graduation

30

Programme Aims

The program is designed to provide students with knowledge/skills in process control/operations, electronic and advanced packaging technologies, and materials in intelligent and semiconductor manufacturing and its related reliability science and quality engineering. Ability to solve problems and develop new processes or equipment. Students are encouraged to participate the projects with the companies. The objective of this programme is to prepare students who wish to pursue graduate degrees or enter the workforce in the field of semiconductor and electronics industry.

Programme Intended Learning Outcomes (PILOs)

Upon successful completion of this Programme, students should be able to:
1. reflect on extensive knowledge in intelligent and semiconductor manufacturing in supporting problem solving, decision making and undertaking projects of discovery and innovation;
2. apply knowledge/skills in semiconductor process control/operations, electronic and advanced packaging technologies, and materials;
3. integrate and apply engineering and knowledge in intelligent and semiconductor manufacturing and its related reliability science and quality engineering;
4. be able to generate innovative ideas, to undertake projects/research and turn the discovery & innovative ideas into practical implementation;
5. reflect on responsibility and sensitivity for environmental and societal concerns, inter-cultural issues and global development.
 

Programme Requirements



Core Courses (12 credit units)
Course CodeCourse TitleCredit Units
ADSE6043Quality and Reliability Engineering3
ADSE6109Semiconductor Manufacturing and Management3
ADSE62013D IC Stacking and Advanced Packaging Technology3
ADSE6202Semiconductor Process Equipment and Materials3


Electives (18 credit units)
Course CodeCourse TitleCredit Units
ADSE6009Project Management3
ADSE6012Technological Innovation and Entrepreneurship3
ADSE6018Dissertation9
ADSE6045Industrial Case Study3
ADSE6047Quality Improvement: Systems and Methodologies3
ADSE6106Intelligent Manufacturing for Engineering Managers3
ADSE6110Data Analysis and Artificial Intelligence for Systems Engineering3
ADSE6203Internship Scheme in Semiconductor Industry3
ADSE6204VLSI/ULSI process integration3
ADSE6205Semiconductor Thin Film Engineering3
ADSE6206Packaging for Nanoelectronics3
ADSE6207Characterization Techniques for Semiconductor Manufacturing3
ADSE8204Process Modelling and Control3
EE6615Nanotechnology for Devices and Microsystems3
MNE6005Micro Systems Technology3
MNE6046Nano-manufacturing3
MNE6051Sustainable Green Manufacturing3
MSE6121Thin Film Technology and Nanocrystalline Coatings3
MSE6171Electronic Packaging and Materials3


Remark: These programme electives will be offered subject to availability of resources.

Professional Recognition

Accreditation from Hong Kong Institution of Engineers will be sought.