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Reaction violence difference revealed by reactive molecular dynamics: Comparison of the thermal decomposition of hexahydro-1, 3, 5-trinitro-1, 3, 5-triazine and benzotrifuroxan

Huang, X., Qiao, Z., Dai, X., Zhang, K., Wen, Y., Li, M., Guo, F.

Chemical Physics Letters

Surface resonance properties of pure Cu and Cu80Zr20 metallic glass films with nanoparticles induced by pulsed-laser dewetting process

Lin, H.K., Wang, Y.T., Chuang, W.S., Chou, H.S., Huang, J.C.

Applied Surface Science

Room- and elevated-temperature nano-scaled mechanical properties of low-density Ti-based medium entropy alloy

Lin, P.H., Huang, J.C., Zhang, X.K., Chou, H.S., Chuang, W.S., Liu, T.Y., Liao, Y.C., Jang, J.S.C.

Materials Science and Engineering A

A high-entropy alloy as very low melting point solder for advanced electronic packaging

Liu, Y., Pu, L., Yang, Y., He, Q., Zhou, Z., Tan, C., Zhao, X., Zhang, Q., Tu, K.N.

Materials Today Advances

High-Efficiency Cellular Reprogramming by Nanoscale Puncturing

Wang, Y., Wang, Z., Xie, K., Zhao, X., Jiang, X., Chen, B., Han, Y., Lu, Y., Huang, L., Zhang, W., Yang, Y., Shi, P.

Medical Additive Manufacturing: From a Frontier Technology to the Research and Development of Products

Qiu, G., Ding, W., Tian, W., Qin, L., Zhao, Y., Zhang, L., Lu, J., Chen, D., Yuan, G., Wu, C., Lu, B., Du, R., Chen, J., Elbestawi, M., Gu, Z., Li, D., Sun, W., Zhao, Y., He, J., Jin, D., Liu, B., Zhang, K., Li, J., Leong, K.W., Zhao, D., Hao, D., Ao, Y., Deng, X., Yang, H., Hsu, S., Chen, Y., Li, L., Fan, J., Nie, G., Chen, Y., Zeng, H., Chen, W., Lai, Y.

Unveiling the Electronic Origin for Pressure-Induced Phase Transitions in High-Entropy Alloys

Liu, W.-H., Tong, Y., Chen, S.-W., Xu, W.-W., Wu, H.-H., Zhao, Y.-L., Yang, T., Wang, X.-L., Liu, X., Kai, J.-J., Liu, C.T.

Breaking the strength-ductility paradox in advanced nanostructured Fe-based alloys through combined Cu and Mn additions

Kong, H.J., Yang, T., Chen, R., Yue, S.Q., Zhang, T.L., Cao, B.X., Wang, C., Liu, W.H., Luan, J.H., Jiao, Z.B., Zhou, B.W., Meng, L.G., Wang, A., Liu, C.T.

Scripta Materialia

Soft-Mode Parameter as an Indicator for the Activation Energy Spectra in Metallic Glass

Zhang, S., Liu, C., Fan, Y., Yang, Y., Guan, P.

Journal of Physical Chemistry Letters

Matched Interface and Boundary Method for Free Vibration Analysis of Irregular Membranes

Song, Z., He, X., Li, W., Xie, D.

International Journal of Computational Methods