ITF - Tier 2 of Innovation and Technology Support Programme (ITSP)

ITSP supports midstream/downstream research and development (R&D) projects undertaken mainly by universities, R&D Centres, industry support organizations, professional bodies and trade and industry associations. Tier 2 involves the funding of applied R&D projects which are industry-oriented and have potential for commercialisation.

Programmes for Application

Platform Research Projects - Requires industry sponsorship support from at least two companies with total cash/in-kind contribution of no less than 10% of the total project cost. Financial contribution from other sources (e.g. university, charitable organizations, venture capitalists and project team members) is welcome, but is not mandatory and cannot be counted as part of the industry sponsorship.

Collaborative Research Projects - For a private company collaborates with a local university or research institute, application requires cash and/or in-kind contribution of no less than 50% of the total project cost.

Internal Deadline: 20 March 2012

Submission of Application

Applications should be submitted either:

a. by hardcopy (with an electronic copy in MS WORD 2003 or above) to RO or
b. electronically through the ITCFAS at the ITF website: https://www3.itf.gov.hk/?itf_lng=en

Application documentation:

- Please include a budget for the auditing fee ($8,000/per year for total project cost less than 1 million, $14,000/per year for total project cost between $1 million and $5 million, $20,000/per year for total project cost more than $5 million) and an administrative overhead charge (15% of total ITF fund requested).
Relevant link:
 

ITC website: http://www.itf.gov.hk/l-eng/ITSP.asp