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電子工程學系博士研究生Ahmed Sharif憑藉有關環保無鉛焊料的研究,於「2004年電子封裝國際會議」中獲頒青年獎,而Ahmed是唯一獲獎的香港學生。
The Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering (EPA Centre) was accredited in December 2003 by the Hong Kong Accreditation Service (HKAS) for its Ionic Analysis of Circuit Board, Ion Chromatography Method.
On 21 November, CityU's Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering (the EPA Centre) was accepted by the Hong Kong Accreditation Service (HKAS) as an Accredited Laboratory* under the Hong Kong Laboratory Accreditation Scheme (HOKLAS). This is a CityU first.

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