ITF - Tier 3 of Innovation and Technology Support Programme (ITSP)

ITSP supports midstream/downstream research and development (R&D) projects undertaken mainly by universities, R&D Centres, industry support organizations, professional bodies and trade and industry associations. Tier 3 projects should be exploratory, forward-looking and innovative in nature to provide the foundation for future applied R&D projects.

Applications under the themes of “Smart Technologies for Helping Combat Climate Change”, “Healthy Ageing”, “Smart City”, “Cyber Security” and “FinTech (Technologies for financial services)” are particularly invited. 

Summary of Major Requirements for Tier 3

Theme Projects should be exploratory and forward- looking in nature to provide the foundation for future applied R&D projects
Funding ceiling HK$1.4 million
Max. project duration 18 months
Industry sponsorship Not mandatory

Internal Deadline: 20 March 2017
ITC Deadline: 31
March 2017

Cash Rebate for Company Sponsors of ITF Projects
Company sponsors will receive a cash rebate equivalent to 40% of its expenditure (cash and in-kind contributions) in the funded ITF projects.  Details of the ITC Cash Rebate Scheme is available at the ITC website:

Submission of Application

Applications should be submitted either:

a. electronically through the ITCFAS II at the ITF website:  or
b. by hardcopy (with an electronic copy in MS WORD 2010 or above) to RO (email:
Please also send the completed Endorsement form to RO via Head and Dean.

Application documentation:


Please include the following budget items in each application:
1) External audit fees: $8,000 for a project costing less than $1 million, or $14,000 for a  project costing over $1 million, and
2) Administrative overhead charge: 15% x Total [Manpower + Equipment + Other Direct Costs - Industry Sponsorship]

Relevant link:

ITC website: