ITF - Tier 3 of Innovation and Technology Support Programme (ITSP)

ITSP supports midstream/downstream research and development (R&D) projects undertaken mainly by universities, R&D Centres, industry support organizations, professional bodies and trade and industry associations. Tier 3 projects should be exploratory, forward-looking and innovative in nature to provide the foundation for future applied R&D projects.

Summary of Major Requirements for Tier 3

Theme No specific themes but projects should be exploratory and forward- looking in nature to provide the foundation for future applied R&D projects
Funding ceiling HK$1 million
Max. project duration 18 months
Industry sponsorship Not mandatory

Internal Deadline: 20 March 2012

Submission of Application

Applications should be submitted either:

a. by hardcopy (with an electronic copy in MS WORD 2003 or above) to RO or
b. electronically through the ITCFAS at the ITF website: https://www3.itf.gov.hk/?itf_lng=en

Application documentation:

- Please include a budget of HK$8,000 for the auditing fee and an administrative overhead charge (15% of total ITF fund requested).
Relevant link:

ITC website: http://www.itf.gov.hk/l-eng/ITSP.asp