Knowledge Transfer Office

Technologies for Licensing - Detail

Direct Current Plasma Immersion Ion Implementation
Principal Investigtor
項目負責人
 
CHU Paul Kim Ho, 朱劍豪 Department of Physics and Materials Science

Country
國家
Patent/Filing No.
專利/申請號
Description
發明名稱
Issued/Filing Date
授權公告/
專利申請日期
Status
狀態
No Record Found.

Stage of Technology Transfer: Commercially viable
Research Area: New Materials and Surface Science > Coating
Abstract
This novel plasma immersion ion implantation technology is performed in a low pressure steady state direct current and long-pulse mode, with the help of a grounded / biased conducting grid positioned between the wafer stage and plasma source.



Uniqueness and Competitive Advantage
• The technology does not require the use of a power modulator which limits the implantation energy. The power modulator is the most expensive and technologically complex hardware component in a plasma immersion ion implantation system


Applications
• For use in microelectronics, biomedical, and materials industries






Contact Information
Mr. Tomson Lee
Senior Technology Transfer Officer
Address: Knowledge Transfer Office, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong
Tel: 94173441
Fax: 34420883
Email: thmlee@cityu.edu.hk