Encouraged by the success of the 1st and 2nd IEEE International NanoElectronics Conference (INEC) held in Singapore in 2006 and Shanghai in 2008, the 3rd INEC will be held in City University of Hong Kong from January 3 to 8, 2010.  Extensive research on nanomaterials has unveiled many interesting and promising material properties for novel applications in electronics, photonics, and biology.  In order to benefit mankind for such discoveries, it is necessary to cross the chasm between nanomaterials and nanodevices and their applications.  This effort will require a multi-disciplinary approach combining research in materials design, processing, modeling, characterization, and metrology.  Commercialization of nanotechnology is also important to fuel future research.  The aim of this conference is to identify the paths between fundamental research and potential electronic, photonic, and biological applications.  INEC2010 will provide a forum for international academics, researchers, practitioners and students working in the areas of nanofabrication, nanoelectronics, nanophotonics, and nanobiology to discuss new developments, concepts and practices, and to identify future research needs so that nano-research can be brought closer to its immense potential.

INEC2010 will feature plenary and invited talks by famous scientists in nanofabrication, nanoelectronics, nanophotonics, and nanobiology.  A special symposium on nanoscience and nanotechnology in China featuring all invited talks by academicians of the Chinese Academy of Sciences, Chinese Academy of Engineering, and Academia Sinica will be held during the conference.  The extended abstracts of all paid/registered papers will be included in the IEEE Xplore database and Engineering Index (EI).  Full contributed papers will be peer reviewed and published in a special issue of Journal of Nanoscience and Nanotechnology (2007 impact factor: 1.987).  A special issue consisting of comprehensive reviews written by plenary/invited speakers will be published in Materials Science and Engineering Reports (2007 impact factor: 14.40).

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