The course aims to provide students with a fundamental understanding of the basic technology and applications to modern electronic packaging in consumer electronic products. The trend of packaging starting from wire-bonding, taping-automatic bonding, flip chip solder joints, micro solder-bumps, and Cu-to-Cu direct bonding as well as hybrid bonding will be covered.
The course is designed so that the students can learn the basic concepts in circuit design of 3D IC in electronic packaging technology. Especially, the materials integration in printed circuit board, multilayered interconnections in back-end-of-line, redistribution layer, Si interposer, through-Si-vias will be covered. Device reliability issues such as electromigration, thermomigration, and stress-migration will be explained clearly. Because Joule heating is the most serious cause of yield and reliability in modern consumer electronic products, the so-called low power device means low entropy or low waste heat production device. For device lifetime prediction, the mean-to-to failure equations will be derived based on entropy production in irreversible processes. How to measure the parameters in the equations will be discussed.