Abstract
Established in 1998, the Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering (EPA Centre) aims at providing turnkey "one-stop-shop" full services to a wide range of electronic manufacturing industries. These include applied R&D, technology transfer, open-access laboratory, consultancy and manpower training in the area of electronic packaging and assemblies. The EPA Centre is equipped with comprehensive and sophisticated equipment such as the Ion Chromatograph, Scanning Acoustic Microscope (SAM), Fourier Transform Infrared Spectrophotometer, Scanning Electron Microscope with Energy Dispersive X-Ray Spectrometer (SEM), Temperature and Humidity Chamber and Hot Air Convection Reflow Oven, etc. which is worth over $20 million.

Contact Information
Mr H Y Wong
Director, Technology Transfer Office
City University of Hong Kong
83 Tat Chee Avenue
Kowloon, Hong Kong
Tel : (852) 2788 8428
Fax : (852) 2788 9119
Email : hy.wong@cityu.edu.hk