Electronics
 
Conductive Adhesive Technology Programme for Fine Pitch Electronic Interconnect
細間距電子封裝導電膠科技計劃
 
Principal Investigator
Professor CHAN, Yan Cheong 陳忍昌 教授 [ Profile ]
Professor (Chair) of Electronic Engineering , Department of Electronic Engineering
Stage of Technology Transfer: fundamental R&D product level
Research Area: Electronics , Industrial Technologies

Abstract
This project aims to promote innovation in the adoption of conductive adhesive technology and provide turnkey 'one-stop-shop' services in technology transfer, consultancy, and manpower training to local electronic industry. Mid-stream R&D projects will also be conducted for nurturing innovations in conductive adhesive technology for mobile consumer electronics. The project outcomes include a dissemination programme of non-proprietary R&D results, and a technology transfer and manpower training programme. This project received financial support under the Innovation and Technology Fund of the HKSAR Government.

Contact Information
Mr H Y Wong
Director, Technology Transfer Office
City University of Hong Kong
83 Tat Chee Avenue
Kowloon, Hong Kong
Tel : (852) 2788 8428
Fax : (852) 2788 9119
Email : hy.wong@cityu.edu.hk

 
• Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering (EPA Centre)
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