Electronics
 
CAD for Electronic Packaging
電子封裝的CAD工具
 
Principal Investigator
Professor TSANG, Leung 曾亮 教授 [ Profile ]
Professor (Chair) of Electronic Engineering , Department of Electronic Engineering
Stage of Technology Transfer: fundamental R&D product level
Research Area: Electronics , Telecommunications

Abstract
Electromagnetic characterization of interconnects is essential in maintaining signal integrity in electronic packages. Market for such kind of CAD software is tremendous. However, they vary in simulation speed, accuracy and unique capabilities. Three professors from the Wireless Communications Research Laboratory at CityU have achieved technological breakthrough in the simulation speed in circuit simulation. Professor L Tsang has developed fast simulation tools for computing electromagnetic radiation from traces on printed-circuit boards. The techniques and software that he has developed have been licensed by TSGAM, a Seattle based company. More recently, he has developed a fast simulation scheme that can simulate electromagnetic interactions among thousands of vias within several CPU minutes based on work at Intel and the University of Washington. For circuit designers, simulation speed is of the highest priority as they have to perform numerous simulations. Error of up to 10% is still tolerable for the initial design. More accurate solution may be required in the fine-tuning of the final design. Professor C H Chan has developed rigorous simulation tools in the frequency and time domain using the integral equation method and the finite-difference time-domain approach, respectively. While electromagnetic characterization is important, results obtained from field simulations normally cannot be used directly by circuit designers. Recently, Professor Kenneth Mei has developed a new scheme that can bridge the gap between the field and circuit simulation by adding an additional source term in the well-known telegraphers' equations. Consequently, circuit designers can now use results from electromagnetic field simulation directly. The research team will integrate all these features into a single simulator. Users have the option to decide the trade-off between the speed and accuracy of their simulations. The simulated results will be cast into the form that is suitable for circuit simulations.

Contact Information
Mr H Y Wong
Director, Technology Transfer Office
City University of Hong Kong
83 Tat Chee Avenue
Kowloon, Hong Kong
Tel : (852) 2788 8428
Fax : (852) 2788 9119
Email : hy.wong@cityu.edu.hk

簡介
管道結構的電磁波特性對於電子路矽基中維持信號完整性是必需的,所以這種CAD軟體在市場上有著巨大的經濟價值。然而,它們在類比速度、準確性和其獨特能力等方面的比較都有不同的特性。最近香港城市大學無線通信研究實驗室的三位講座教授在電路類比中的類比速度取得技術上的重大突破。

曾亮教授已經研究出印刷電路板耦合路徑中計算其電磁輻射的快速類比工具,他所發展的技術和軟體已經被名為TSGAM的一家西雅圖公司認可。最近,曾教授發展了一個能類比計算數以千計管道結構的電磁波交互作用的快速類比方案,這方案在一些英代爾和華盛頓大學的工作平台上只需數分鐘的處理時間。又因為這方案必須運行很多的計算類比,所以對於線路設計者來說,類比速度必須取得最高的優先權,而錯誤在10%以下對開始的設計仍然是可容忍的。較正確的答案亦因此需要在最後的設計中微調。

陳志豪教授分別在頻率和時間領域中發展出積分方程法和時域有限差分法的快速類比工具,也正因為電磁的描述的重要性,從領域類比所獲得的結果通常不能夠被線路設計者直接使用。

另外,梅冠香教授也發展出一個能克服在領域和線路類比之間的縫隙新方案。這方案是在報務員常用的方程中增加一個附加的來源術語。現在,線路設計者因此能從電磁場類比直接的使用其結果。我們的目標是把所有的特徵整合以成為一個單一模擬器。使用者能夠在類比速度和準確性之間有著選擇的權利,而類比結果會使用適當的形式以配合線路類比。

查詢
香港城市大學技術轉移處處長黃漢儀先生
地址 : 香港九龍達之路83號
電話 : (852) 2788 8428
傳真 : (852) 2788 9119
電郵 : hy.wong@cityu.edu.hk

 
3-dimensional Via Structure 三維管道結構
 
CAD tools for simulating via structure
計算三維管道結構CAD工具
 
CAD tools for simulating via structure
計算三維管道結構CAD工具
 
CAD tools for simulating layered medium structure with dielectric substrate 計算層狀介質結構CAD工具
• Wireless Communications Research Centre
• CityU Today (Jan 2002)
All Rights Reserved. TOP
For best viewing, use Explorer 4.0 or higher and set your monitor for 1024x768 pixels.